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IEC/TR 62878-2-9 Ed. 1.0 en:2022
M00007870
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IEC/TR 62878-2-9 Ed. 1.0 en:2022 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO Level in the electronic assembly technology industries
standard by International Electrotechnical Commission - Technical Report, 04/01/2022
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The purpose of this Technical Report is to comprise the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the "concept of Jisso" as well as the "Jisso product level" for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached.
Further discussion on "Jisso Product Level" could be needed among the current JIC members to finalize it in the near future based on this technical report.