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IEC 60050-393 Ed. 2.0 b:2003 [ Withdrawn ]
IEC 60050-393 Ed. 2.0 b:2003 [ Withdrawn ] International Electrotechnical Vocabulary - Part 393: Nuclear instrumentation - Physical phenomena and basic concepts standard by International Electrotechnical Commission, 08/19/2003
$176.73 $411.00 -57%In Stock -
IEC 60335-2-90 Ed. 2.1 b:2003 [ Withdrawn ]
IEC 60335-2-90 Ed. 2.1 b:2003 [ Withdrawn ] Household and similar electrical appliances - Safety - Part 2-90: Particular requirements for commercial microwave ovens CONSOLIDATED EDITION standard by International Electrotechnical Commission, 08/19/2003
$39.13 $91.00 -57%In Stock -
IEC 60137 Ed. 5.0 b:2003 [ Withdrawn ]
IEC 60137 Ed. 5.0 b:2003 [ Withdrawn ] Insulated bushings for alternating voltages above 1000 V standard by International Electrotechnical Commission, 08/18/2003
$76.97 $179.00 -57%In Stock -
IEC 60695-11-20 Ed. 1.1 b:2003 [ Withdrawn ]
IEC 60695-11-20 Ed. 1.1 b:2003 [ Withdrawn ] Fire hazard testing - Part 11-20: Test flames - 500 W flame test methods CONSOLIDATED EDITION standard by International Electrotechnical Commission, 08/14/2003
$72.67 $169.00 -57%In Stock -
IEC 60749-32 Ed. 1.0 b CORR1:2003
IEC 60749-32 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 62271-102 Ed. 1.0 b:2003
IEC 62271-102 Ed. 1.0 b:2003 High-voltage switchgear and controlgear - Part 102: Alternating current disconnectors and earthing switches standard by International Electrotechnical Commission, 08/14/2003
$111.80 $260.00 -57%In Stock -
IEC 60749-22 Ed. 1.0 b CORR1:2003
IEC 60749-22 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-31 Ed. 1.0 b CORR1:2003
IEC 60749-31 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-20 Ed. 1.0 b CORR1:2003
IEC 60749-20 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-13 Ed. 1.0 b CORR1:2003
IEC 60749-13 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-12 Ed. 1.0 b CORR1:2003
IEC 60749-12 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-11 Ed. 1.0 b CORR2:2003
IEC 60749-11 Ed. 1.0 b CORR2:2003 Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock
![IEC 60050-393 Ed. 2.0 b:2003 [ Withdrawn ]](https://www.filelook.org/img/p/en-default-home_default.jpg "IEC 60050-393 Ed. 2.0 b:2003 [ Withdrawn ]")