IEC 60749-10 Ed. 1.0 b:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock standard by International Electrotechnical Commission, 04/09/2002
IEC 60034-12 Ed. 2.0 b:2002 [ Withdrawn ] Rotating electrical machines - Part 12: Starting performance of single-speed three-phase cage induction motors standard by International Electrotechnical Commission, 04/09/2002
IEC 60749-3 Ed. 1.0 b:2002 [ Withdrawn ] Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection standard by International Electrotechnical Commission, 04/09/2002
IEC 60749-7 Ed. 1.0 b:2002 [ Withdrawn ] Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases standard by International Electrotechnical Commission, 04/09/2002
IEC 61000-2-2 Ed. 2.0 b:2002 Electromagnetic compatibility (EMC) - Part 2-2: Environment - Compatibility levels for low-frequency conducted disturbances and signalling in public low-voltage power supply systems standard by International Electrotechnical Commission, 03/28/2002
IEC 61000-4-13 Ed. 1.0 b:2002 Electromagnetic compatibility (EMC) - Part 4-13: Testing and measurement techniques - Harmonics and interharmonics including mains signalling at a.c. power port, low frequency immunity tests standard by International Electrotechnical Commission, 03/27/2002
IEC 60947-4-2 Ed. 2.1 b:2002 [ Withdrawn ] Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters CONSOLIDATED EDITION standard by International Electrotechnical Commission, 03/26/2002
IEC 62087 Ed. 1.0 en:2002 [ Withdrawn ] Methods of measurement for the power consumption of audio, video and related equipment standard by International Electrotechnical Commission, 03/26/2002
IEC 60747-5-2 Amd.1 Ed. 1.0 b:2002 [ Withdrawn ] Amendment 1 - Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics Amendment by International Electrotechnical Commission, 03/25/2002
IEC 61190-1-1 Ed. 1.0 b:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly standard by International Electrotechnical Commission, 03/25/2002
IEC 61340-3-2 Ed. 1.0 b:2002 [ Withdrawn ] Electrostatics - Part 3-2: Methods for simulation of electrostatic effects - Machine model (MM) - Component testing standard by International Electrotechnical Commission, 03/25/2002
IEC 60747-5-1 Amd.2 Ed. 1.0 b:2002 [ Withdrawn ] Amendment 2 - Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General Amendment by International Electrotechnical Commission, 03/25/2002