IEC 62769-151-1 Ed. 1.0 b:2023 Field device integration (FDI)® – Part 151-1: Profiles – OPC UA standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-103-1 Ed. 3.0 b:2023 Field Device Integration (FDI) - Part 103-1: Profiles - PROFIBUS standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-8 Ed. 1.0 b:2023 Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping standard by International Electrotechnical Commission, 04/01/2023
IEC 62386-251 Ed. 1.0 b:2023 Digital addressable lighting interface – Part 251: Particular requirements – Memory bank 1 extension (device type 50) standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-150-1 Ed. 2.0 b:2023 Field device integration (FDI)® – Part 150-1: Profiles – ISA100 standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-109-1 Ed. 3.0 b:2023 Field device integration (FDI)® – Part 109-1: Profiles – HART® and WirelessHART® standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-6 Ed. 3.0 b:2023 Field Device Integration (FDI) - Part 6: FDI Technology Mapping standard by International Electrotechnical Commission, 04/01/2023
IEC 60794-1-301 Ed. 1.0 b:2023 Optical fibre cables – Part 1-301: Generic specification – Basic optical cable test procedures – Cable elements test methods – Bend test, method G1 standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-6-100 Ed. 1.0 b:2023 Field Device Integration (FDI®) – Part 6-100: Technology Mapping – .Net standard by International Electrotechnical Commission, 04/01/2023
IEC 60794-1-303 Ed. 1.0 b:2023 Optical fibre cables – Part 1-303: Generic specification – Basic optical cable test procedures – Ribbon dimensions – Aperture gauge, method G3 standard by International Electrotechnical Commission, 04/01/2023
IEC 60794-1-309 Ed. 1.0 b:2023 Optical fibre cables – Part 1-309: Generic specification – Basic optical cable test procedures – Cable element test methods – Bleeding and evaporation of filling or flooding compounds, Method G9 standard by International Electrotechnical Commission, 04/01/2023
IEC 62769-101-1 Ed. 3.0 b:2023 Field device Integration (FDI) - Part 101-1: Profiles - Foundation Fieldbus H1 standard by International Electrotechnical Commission, 04/01/2023