IPC J-STD-003C-WAM1 Solderability Tests for Printed Boards with Amendment 1 standard by Association Connecting Electronics Industries, 05/01/2014
IPC 4101D Specification for Base Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 04/01/2014
IPC 1752A-WAM1-2 Materials Declaration Management with Amendments 1 & 2 standard by Association Connecting Electronics Industries, 02/01/2014
IPC J-STD-030A Selection and Application of Board Level Underfill Materials standard by Association Connecting Electronics Industries, 02/01/2014
IPC 4103A-WAM1 Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1 standard by Association Connecting Electronics Industries, 01/01/2014
IPC 9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection standard by Association Connecting Electronics Industries, 12/01/2013
IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing standard by Association Connecting Electronics Industries, 11/01/2013
IPC A-610FC-Telecom(D)1 Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies Amendment by Association Connecting Electronics Industries, 01/01/2017
IPC J-STD-001FS WAM1 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies Amendment by Association Connecting Electronics Industries, 2017
IPC 7711/7721C Rework, Modification and Repair of Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/2017
IPC A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies standard by Association Connecting Electronics Industries, 01/01/2017
IPC 4202B Flexible Base Dielectrics for Use in Flexible Printed Boards standard by Association Connecting Electronics Industries, 12/01/2016