IPC A-610G Acceptability of Electronic Assemblies standard by Association Connecting Electronics Industries, 10/31/2017
IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 10/31/2017
IPC 9505 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility standard by Association Connecting Electronics Industries, 09/27/2017
IPC 6012D-AM1 Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 standard by Association Connecting Electronics Industries, 09/01/2017
IPC 2226A Sectional Design Standard for High Density Interconnect (HDI) Printed Boards standard by Association Connecting Electronics Industries, 09/01/2017
IPC 6013D Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards standard by Association Connecting Electronics Industries, 09/01/2017
IPC 4552A Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards standard by Association Connecting Electronics Industries, 08/01/2017
IPC A-640 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies standard by Association Connecting Electronics Industries, 07/01/2017
IPC 7091 Design and Assembly Process Implementation of 3D Components standard by Association Connecting Electronics Industries, 06/01/2017
IPC 4921A Requirements for Printed Electronics Base Materials (Substrates) standard by Association Connecting Electronics Industries, 05/01/2017
IPC 7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) standard by Association Connecting Electronics Industries, 03/01/2017
IPC 1401 Supply Chain Social Responsibility Management System Guidance standard by Association Connecting Electronics Industries, 03/01/2017