IEC 60749-15 Ed. 2.0 b:2010
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
standard by International Electrotechnical Commission, 10/28/2010
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.
Product Details
Edition: 2.0 Published: 10/28/2010 Number of Pages: 14File Size: 1 file , 430 KB