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IEC 62374-1 Ed. 1.0 b:2010

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IEC 62374-1 Ed. 1.0 b:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

standard by International Electrotechnical Commission, 09/29/2010

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IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

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Edition: 1.0 Published: 09/29/2010 Number of Pages: 32File Size: 1 file , 490 KB