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IEC 60749-19 Amd.1 Ed. 1.0 b:2010
New product
IEC 60749-19 Amd.1 Ed. 1.0 b:2010 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amendment by International Electrotechnical Commission, 07/28/2010