Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
Sale!
View larger
View larger
IEC 61191-2 Ed. 2.0 b:2013 [ Withdrawn ]
New product
IEC 61191-2 Ed. 2.0 b:2013 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
standard by International Electrotechnical Commission, 06/05/2013
More info
Full Description
IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.