IEC 61188-5-4 Ed. 1.0 en:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
standard by International Electrotechnical Commission, 10/30/2007
Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Product Details
Edition: 1.0 Published: 10/30/2007 Number of Pages: 15File Size: 1 file , 840 KB