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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting). Product Details
Edition: 1.0 Published: 08/28/1998 Number of Pages: 31File Size: 1 file , 530 KB