> IEC 60749-3 Ed. 1.0 b:2002 [ Withdrawn ]
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IEC 60749-3 Ed. 1.0 b:2002 [ Withdrawn ]

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IEC 60749-3 Ed. 1.0 b:2002 [ Withdrawn ] Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

standard by International Electrotechnical Commission, 04/09/2002

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Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

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Edition: 1.0 Published: 04/09/2002 Number of Pages: 7File Size: 1 file , 360 KB