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IEC 61190-1-1 Ed. 1.0 b:2002

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IEC 61190-1-1 Ed. 1.0 b:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

standard by International Electrotechnical Commission, 03/25/2002

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Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

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Edition: 1.0 Published: 03/25/2002 Number of Pages: 41File Size: 1 file , 570 KB