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IEC 60512-6-2 Ed. 1.0 b:2002

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IEC 60512-6-2 Ed. 1.0 b:2002 Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump

standard by International Electrotechnical Commission, 02/21/2002

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Full Description

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

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Edition: 1.0 Published: 02/21/2002 Number of Pages: 9File Size: 1 file , 400 KB