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IPC 2223D

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IPC 2223D Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

standard by Association Connecting Electronics Industries, 09/01/2016

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Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and requirements for material selection and construction, selective (button) plating, minimum bending for flexible circuits with coverlay, impedance and capacitance control, unsupported edge conductors/fingers and copper filled vias/microvias.

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Published: 09/01/2016 ISBN(s): 9781611932645 Number of Pages: 60File Size: 1 file , 7.1 MB