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IPC WP-009

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IPC WP-009 A Summary of Tin Whisker Research References

standard by Association Connecting Electronics Industries, 03/01/2009

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As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the predominant research on tin whiskers as of September, 2008. 15 pages. Released March 2009.

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Published: 03/01/2009 Number of Pages: 20File Size: 1 file , 1.4 MB