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IPC 7525A

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IPC 7525A Stencil Design Guidelines

standard by Association Connecting Electronics Industries, 02/01/2007

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$85.00

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Now includes support for stencils used with lead free processes.

This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

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Published: 02/01/2007 Number of Pages: 28File Size: 1 file , 800 KB