Full Description

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Product Details

Published: 02/01/2003 Number of Pages: 20File Size: 1 file , 90 KB Product Code(s): J-027(D)1, J-027(D)1