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IPC 3408

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IPC 3408 General Requirements for Anisotropically Conductive Adhesives Films

standard by Association Connecting Electronics Industries, 11/01/1996

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This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

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Published: 11/01/1996 Number of Pages: 32File Size: 1 file , 480 KB Product Code(s): 3408(D)1