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IPC HM-860

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IPC HM-860 Specification for Multilayer Hybrid Circuits

standard by Association Connecting Electronics Industries, 01/10/1987

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$152.00

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Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.

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Published: 01/10/1987 Number of Pages: 66File Size: 1 file , 550 KB Product Code(s): HM-860(D)1