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IEC 61189-2-803 Ed. 1.0 b:2023
M00012763
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IEC 61189-2-803 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
standard by International Electrotechnical Commission, 07/01/2023
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This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).