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IPC 7092A

M00013653

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IPC 7092A Design and Assembly Process Implementation for Embedded Components

standard by Association Connecting Electronics Industries, 10/01/2022

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Full Description

This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.