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IPC 6018D

M00013700

New product

IPC 6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

standard by Association Connecting Electronics Industries, 02/01/2022

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This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.