IPC 4554 Specification for Immersion Tin Plating for Printed Circuit Boards standard by Association Connecting Electronics Industries, 01/01/2007
IPC 9261A In-Process DPMO and Estimated Yield for PCAs standard by Association Connecting Electronics Industries, 10/01/2006
IPC A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies standard by Association Connecting Electronics Industries, 07/01/2006
IPC 4761 Design Guide for Protection of Printed Board Via Structures Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2006
IPC 4101B Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007) standard by Association Connecting Electronics Industries, 06/01/2006
IPC TR 585 Time, Temperature and Humidity Stress of Final Board Finish Solderability standard by Association Connecting Electronics Industries, 05/01/2006
IPC 4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 05/01/2006
IPC 9591 Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices standard by Association Connecting Electronics Industries, 04/01/2006
IPC 6013A Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 2 standard by Association Connecting Electronics Industries, 04/01/2006
IPC JP002 JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline standard by Association Connecting Electronics Industries, 03/01/2006
IPC 9701A Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments standard by Association Connecting Electronics Industries, 02/01/2006
IPC J-STD-006B Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications standard by Association Connecting Electronics Industries, 01/01/2006