IPC 7095A Design and Assembly Process Implementation for BGAs standard by Association Connecting Electronics Industries, 01/01/2005
IPC 9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline standard by Association Connecting Electronics Industries, 09/01/2004
IPC 6012B Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 standard by Association Connecting Electronics Industries, 08/01/2004
IPC J-STD-020C Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device standard by Association Connecting Electronics Industries, 07/01/2004
IPC A-600G Acceptability of Printed Boards standard by Association Connecting Electronics Industries, 07/01/2004
IPC 2223A Sectional Design Standard for Flexible Printed Boards standard by Association Connecting Electronics Industries, 06/01/2004
IPC 9702 Monotonic Bend Characterization of Board-Level Interconnects standard by Association Connecting Electronics Industries, 06/01/2004
IPC J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires standard by Association Connecting Electronics Industries, 02/01/2003
IPC J-STD-003A Solderability Tests for Printed Boards standard by Association Connecting Electronics Industries, 02/01/2003
IPC J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations standard by Association Connecting Electronics Industries, 02/01/2003
IPC HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2002
IPC 4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2 standard by Association Connecting Electronics Industries, 10/01/2002