IPC 6801 Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards standard by Association Connecting Electronics Industries, 01/01/2000
IPC TMRC-00M 2000 Market For Electronics Manufacturing Services Providers/Contract Assembly Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC TMRC-00R 2000 Analysis for Rigid Printed Wiring Boards and Related Materials Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC TMRC-00T 2000 Technology Trends for Printed Wiring Boards Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC TMRC-00F 2000 Analysis of the Market for Flexible Circuits Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC A-610C Acceptability of Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/2000
IPC 9191 General Guidelines for Implementation of Statistical Process Control (SPC) standard by Association Connecting Electronics Industries, 11/01/1999
IPC 6202 Performance guide Manual for single- and double-sided flexible printed wiring boards standard by Association Connecting Electronics Industries, 10/01/1999
IPC 6012A-AM Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1 standard by Association Connecting Electronics Industries, 10/01/1999
IPC SC-60A Post Solder Solvent Cleaning Handbook standard by Association Connecting Electronics Industries, 08/01/1999
IPC CHIPSCALE-99 Chip Scale and BGA National Symposium Proceedings 1999 Conference Proceeding by Association Connecting Electronics Industries, 05/01/1999
IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials standard by Association Connecting Electronics Industries, 05/01/1999