IPC TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations standard by Association Connecting Electronics Industries, 07/01/2001
IPC 7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes standard by Association Connecting Electronics Industries, 06/01/2001
IPC 4411-AM1 Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1 Amendment by Association Connecting Electronics Industries, 03/01/2001
IPC 4411-K Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, with Amendment 1 standard by Association Connecting Electronics Industries, 03/01/2001
IPC 2518A Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2517A Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2516A Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2515A Sectional Requirements for Implementation of Bare-Board Product Testing Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2514A Sectional Requirements for Implementation of Printed Board Fabrication Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2512A Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2513A Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description standard by Association Connecting Electronics Industries, 11/01/2000
IPC 2615 Printed Board Dimensions and Tolerances standard by Association Connecting Electronics Industries, 07/01/2000