IPC J-STD-028 Performance Standard fo Construction of Flip Chip and Chip Scale Bumps standard by Association Connecting Electronics Industries, 04/01/1999
IPC QE-605A Printed Board Quality Evaluation Handbook standard by Association Connecting Electronics Industries, 02/01/1999
IPC TMRC99R TMRC 1999 Market for Flexible Circuits - TMRC99F Report / Survey by Association Connecting Electronics Industries, 01/01/1999
IPC BET-99 National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC CH-65A Guidelines for Cleaning of Printed Boards and Assemblies Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
IPC FLEX-CO-99 IPC National Conference Flexible Circuits Volume I & II - Denver, CO 1999 Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC TP-1115 Selection and Implementation Strategy for a Low-Residue, No-Clean Process standard by Association Connecting Electronics Industries, 12/01/1998
IPC EAE-98 Electronics Assembly Expo 1998 standard by Association Connecting Electronics Industries, 11/01/1998
Resin Coated Metal Foil for Printed Boards Book by Association Connecting Electronics Industries, 09/01/1998
IPC 4130 Specification and Characterization Methods for Nonwoven "E" Glass Materials standard by Association Connecting Electronics Industries, 09/01/1998
IPC 4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards standard by Association Connecting Electronics Industries, 08/01/1998
IPC 9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) standard by Association Connecting Electronics Industries, 06/01/1998