IPC TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies standard by Association Connecting Electronics Industries, 01/01/1997
IPC 3408 General Requirements for Anisotropically Conductive Adhesives Films standard by Association Connecting Electronics Industries, 11/01/1996
IPC TR-467 Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes) standard by Association Connecting Electronics Industries, 11/01/1996
IPC J-STD-013 Implementation of Ball Grid Array and Other High Density Technology standard by Association Connecting Electronics Industries, 08/01/1996
IPC D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996
IPC QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards standard by Association Connecting Electronics Industries, 02/01/1992
IPC FA-251 Guidelines for Assembly of Single-Sided and Double-Sided Flexible Printed Circuits Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/1992
IPC D-310C Guidelines for Phototool Generation and Measurement Techniques Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/1991
IPC TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and II standard by Association Connecting Electronics Industries, 03/01/1991
IPC SM-784 Guidelines for Chip-on-Board Technology Implementation standard by Association Connecting Electronics Industries, 11/01/1990
IPC MB-380 Guidelines for Molded Interconnection Devices Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/1990
IPC A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards standard by Association Connecting Electronics Industries, 06/01/1990