IPC 6011 Generic Performance Specification for Printed Boards standard by Association Connecting Electronics Industries, 07/01/1996
IPC TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase 11A standard by Association Connecting Electronics Industries, 07/01/1996
IPC 3406 Guidelines for Electrically Conductive Surface Mount Adhesives standard by Association Connecting Electronics Industries, 07/01/1996
IPC A-311 Process Controls for Phototool Generation and Use standard by Association Connecting Electronics Industries, 03/01/1996
IPC AC-62A [ Withdrawn ] Post Solder Aqueous Cleaning Handbook Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1996
IPC SM-840C Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1 standard by Association Connecting Electronics Industries, 01/01/1996
IPC J-STD-012 Implementation of Flip Chip and Chip Scale Technology standard by Association Connecting Electronics Industries, 01/01/1996
IPC 9501 PWB Assembly Process Simulation for Evaluation of Electronic Components standard by Association Connecting Electronics Industries, 07/10/1995
IPC DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules standard by Association Connecting Electronics Industries, 08/01/1995
IPC DW-425A Design and End Product Requirements for Discrete Wiring Boards standard by Association Connecting Electronics Industries, 05/01/1995
IPC D-325A Documentation Requirements for Printed Boards standard by Association Connecting Electronics Industries, 05/01/1995
IPC TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test standard by Association Connecting Electronics Industries, 04/01/1995